Rogers RO4003C 2-Layer 8mil RF High-Frequency PCB with Immersion Silver
1.Introduction of RO3206
Rogers RO4003C materials are proprietary woven glass reinforced hydrocarbon/ceramics with the electrical performance of PTFE/woven glass and the manufacturability of epoxy/glass.
Offered in various configurations, RO4003C laminates utilize both 1080 and 1674 glass fabric styles with all configurations meeting the same laminate electrical performance specification. RO4003C laminates provide tight control on dielectric constant (Dk) and low loss while utilizing the same processing method as standard epoxy/glass but at a fraction of the cost of conventional microwave laminates. Unlike PTFE based microwave materials, no special through-hole treatments or handling procedures are required.
RO4003C materials are non-brominated and are not UL 94 V-0 rated.
RO4003C material's thermal coefficient of expansion (CTE) provides several key benefits to the circuit designer. The expansion coefficient of RO4003C material is similar to that of copper which allows the material to exhibit excellent dimensional stability, a property needed for mixed dielectric multi-layer boards constructions. The low Z-axis CTE of RO4003C laminates provides reliable plated through-hole quality, even in severe thermal shock applications. RO4003C material has a Tg of >280°C (536°F) so its expansion characteristics remain stable over the entire range of circuit processing temperatures.
2.Key Features
Dielectric Constant of DK 3.38 +/-0.05 at 10GHz
Dissipation Factor of 0.0027 at 10GHz, 0.0021 at 2.5GHz
Thermal Coefficient of dielectric constant of +40 ppm/°C
Thermal Conductivity 0.71 W/m/°K
X axis CTE of 11ppm/°C, Y CTE of 14ppm/°C, Z CTE of 46ppm/°C
Low moisture absorption of 0.06%
3.Benefits
Ideal for multi-layer board (MLB) constructions
Processes like FR-4 at lower fabrication cost
Designed for performance sensitive, high volume applications
Competitively priced
4.PCB Construction Details
| Specification | Value |
|---|---|
| Base Material | RO4003C |
| Layer Count | 2-layer |
| Board Dimensions | 54mm × 58mm (±0.15mm) |
| Minimum Trace/Space | 4/6 mils |
| Minimum Hole Size | 0.2mm |
| Blind Vias | No |
| Finished Board Thickness | 0.3mm |
| Finished Cu Weight (Outer Layers) | 1oz (1.4 mils) |
| Via Plating Thickness | 20 µm |
| Surface Finish | Immersion Silver |
| Top Silkscreen | Black |
| Bottom Silkscreen | No |
| Top Solder Mask | No |
| Bottom Solder Mask | No |
| Electrical Test | 100% prior to shipment |
5.PCB Stackup (2-Layer Rigid Structure)
Copper layer 1 – 35 µm
Rogers 4003C Core – 0.203 mm (8mil)
Copper layer 2 – 35 µm
6.PCB Statistics:
Components: 14
Total Pads: 22
Thru Hole Pads: 12
Top SMT Pads: 10
Bottom SMT Pads: 0
Vias: 19
Nets: 2
7.Typical Applications
Cellular Base Station Antennas and Power Amplifiers
RF Identification Tags
Automotive Radar and Sensors
LNB's for Direct Broadcast Satellites
8.Quality Assurance
Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class-2
Availability: Worldwide
